As the scale of integrated circuits (ICs) continues to shrink, the lack of practical methods for imaging their complex internal structure has hampered feedback for quality control and product development. A collaboration led by Mirko Holler at the Paul Scherrer Institut in Switzerland has published work in Nature that shows how X-rays can be used to produce 3D renderings of the internal structure of ICs with resolutions as low as 14.6 nm in all three dimensions……
http://nanotechweb.org/cws/article/tech/68397
