Placing just one atomic plane of graphene on the surface of a copper film can substantially increase the thermal conductivity of the film. This new, and somewhat surprising result, comes from researchers at the University of Manchester in the UK and the University of California-Riverside in the US, who say that the improvement comes from changes in the copper’s morphology rather than from graphene acting as an additional heat conducting channel. The finding could be important for thermal management applications – such as cooling down electronic chips and in hybrid graphene-copper interconnects……….
http://nanotechweb.org/cws/article/tech/56457
